
The company confirmed that its latest-generation HBM3E chips are now being shipped to “all related customers,” a possible sign that supply to major AI chipmakers like Nvidia may be stabilizing.
With mass production of HBM4 expected next year, Samsung could eventually help relieve pressure on the broader enterprise infrastructure ecosystem, from cloud providers building new AI clusters to data center operators seeking to expand switching and storage capacity.
Samsung’s Foundry division also plans to begin operating its new 2nm fab in Taylor, Texas, in 2026 and supply HBM4 base-dies, a move that could further stabilize component availability for US cloud and networking infrastructure providers.
Easing the memory chokehold
Easing DRAM and NAND lead times will unlock delayed infrastructure projects, particularly among hyperscalers, according to Manish Rawat, semiconductor analyst at TechInsights.
“As component availability improves from months to weeks, deferred server and storage upgrades can transition to active scheduling,” Rawat said. “Hyperscalers are expected to lead these restarts, followed by large enterprises once pricing and delivery stabilize. Improved access to high-density memory will also drive faster refresh cycles and higher-performance rack designs, favoring denser server configurations. Procurement models may shift from long-term, buffer-heavy strategies to more agile, just-in-time or spot-buy approaches.”
Samsung’s expanded role as a “meaningful volume supplier” of HBM3E 12-high DRAM will also be crucial for hyperscalers planning their 2026 AI infrastructure rollouts, according to Danish Faruqui, CEO of Fab Economics.
“Without Samsung’s contribution, most hyperscaler ASIC programs, including Google’s TPU v7, AWS’s Trainium 3, and Microsoft’s in-house accelerators, were facing one- to two-quarter delays due to the limited HBM3E 12-high supply from SK Hynix,” Faruqui said. “These products form the backbone of next-generation AI data centers, and volume ramp-up depends directly on Samsung’s ability to deliver.”





















