The top strategy so far is what one enterprise calls the “Cloud Team.” You assemble all your people with cloud skills, and your own best software architect, and have the team examine current and proposed cloud applications, looking for a high-level approach that meets business goals. In this process, the team tries to avoid implementation specifics, focusing instead on the notion that a hybrid application has an agile cloud side and a governance-and-sovereignty data center side, and what has to be done is push functionality into the right place. The Cloud Team supporters say that an experienced application architect can deal with the cloud in abstract, without detailed knowledge of cloud tools and costs. For example, the architect can assess the value of using an event-driven versus transactional model without fixating on how either could be done. The idea is to first come up with approaches. Then, developers could work with cloud providers to map each approach to an implementation, and assess the costs, benefits, and risks. Ok, I lied about this being the top strategy—sort of, at least. It’s the only strategy that’s making much sense. The enterprises all start their cloud-reassessment journey on a different tack, but they agree it doesn’t work. The knee-jerk approach to cloud costs is to attack the implementation, not the design. What cloud features did you pick? Could you find ones that cost less? Could you perhaps shed all the special features and just host containers or VMs with no web services at all? Enterprises who try this, meaning almost all of them, report that they save less than 15% on cloud costs, a rate of savings that means roughly a five-year payback on the costs of making the application changes…if they can make them at all. Enterprises used to build all of

“Silicon photonics can transform HPC, data centers, and networking by providing greater scalability, better energy efficiency, and seamless integration with existing semiconductor manufacturing and packaging technologies,” Jagadeesan added. “Lightmatter’s recent announcement of the Passage L200 co-packaged optics and M1000 reference platform demonstrates an important step toward addressing the interconnect bandwidth and latency between accelerators in AI data centers.” The market timing appears strategic, as enterprises worldwide face increasing computational demands from AI workloads while simultaneously confronting the physical limitations of traditional semiconductor scaling. Silicon photonics offers a potential path forward as conventional approaches reach their limits. Practical applications For enterprise IT leaders, Lightmatter’s technology could impact several key areas of infrastructure planning. AI development teams could see significantly reduced training times for complex models, enabling faster iteration and deployment of AI solutions. Real-time AI applications could benefit from lower latency between processing units, improving responsiveness for time-sensitive operations. Data centers could potentially achieve higher computational density with fewer networking bottlenecks, allowing more efficient use of physical space and resources. Infrastructure costs might be optimized by more efficient utilization of expensive GPU resources, as processors spend less time waiting for data and more time computing. These benefits would be particularly valuable for financial services, healthcare, research institutions, and technology companies working with large-scale AI deployments. Organizations that rely on real-time analysis of large datasets or require rapid training and deployment of complex AI models stand to gain the most from the technology. “Silicon photonics will be a key technology for interconnects across accelerators, racks, and data center fabrics,” Jagadeesan pointed out. “Chiplets and advanced packaging will coexist and dominate intra-package communication. The key aspect is integration, that is companies who have the potential to combine photonics, chiplets, and packaging in a more efficient way will gain competitive advantage.”

The kit utilizes the PCIe Dual Ported enterprise-grade SM8366 controller with support for PCIe Gen 5 x4 NVMe 2.0 and OCP 2.5 data center specifications. The 128TB SSD RDK also supports NVMe 2.0 Flexible Data Placement (FDP), a feature that allows advanced data management and improved SSD write efficiency and endurance. “Silicon Motion’s MonTitan SSD RDK offers a comprehensive solution for our customers, enabling them to rapidly develop and deploy enterprise-class SSDs tailored for AI data center and edge server applications.” said Alex Chou, senior vice president of the enterprise storage & display interface solution business at Silicon Motion. Silicon Motion doesn’t make drives, rather it makes reference design kits in different form factors that its customers use to build their own product. Its kits come in E1.S, E3.S, and U.2 form factors. The E1.S and U.2 forms mirror the M.2, which looks like a stick of gum and installs on the motherboard. There are PCI Express enclosures that hold four to six of those drives and plug into one card slot and appear to the system as a single drive.

Michael Lahoud, Stream Data Centers: For the past two years, Stream Data Centers has been developing a modular, configurable air and liquid cooling system that can handle the highest densities in both mediums. Based on our collaboration with customers, we see a future that still requires both cooling mediums, but with the flexibility to deploy either type as the IT stack destined for that space demands. With this necessity as a backdrop, we saw a need to develop a scalable mix-and-match front-end thermal solution that gives us the ability to late bind the equipment we need to meet our customers’ changing cooling needs. It’s well understood that liquid far outperforms air in its ability to transport heat, but further to this, with the right IT configuration, cooling fluid temperatures can also be raised, and this affords operators the ability to use economization for a greater number of hours a year. These key properties can help reduce the energy needed for the mechanical part of a data center’s operations substantially.  It should also be noted that as servers are redesigned for liquid cooling and the onboard server fans get removed or reduced in quantity, more of the critical power delivered to the server is being used for compute. This means that liquid cooling also drives an improvement in overall compute productivity despite not being noted in facility PUE metrics.  Counter to air cooling, liquid cooling certainly has some added management challenges related to fluid cleanliness, concurrent maintainability and resiliency/redundancy, but once those are accounted for, the clusters become stable, efficient and more sustainable with improved overall productivity.

“Businesses are becoming increasingly global and digital-first, with industries such as financial services, data centers, and social media platforms relying heavily on real-time, uninterrupted data flow,” Sinha added. The 2Africa Pearls submarine cable system spans 45,000 kilometers, involving a consortium of global telecommunications leaders including Bayobab, China Mobile International, Meta, Orange, Telecom Egypt, Vodafone Group, and WIOCC. Alcatel Submarine Networks is responsible for the cable’s manufacturing and installation, the statement added. This cable system is part of a broader global effort to enhance international digital connectivity. Unlike traditional telecommunications infrastructure, the 2Africa Pearls project represents a collaborative approach to solving complex global communication challenges. “The 100 Tbps capacity of the 2Africa Pearls cable significantly surpasses most existing submarine cable systems, positioning India as a key hub for high-speed connectivity between Africa, Europe, and Asia,” said Prabhu Ram, VP for Industry Research Group at CyberMedia Research. According to Sinha, Airtel’s infrastructure now spans “over 400,000 route kilometers across 34+ cables, connecting 50 countries across five continents. This expansive infrastructure ensures businesses and individuals stay seamlessly connected, wherever they are.” Gogia further emphasizes the broader implications, noting, “What also stands out is the partnership behind this — Airtel working with Meta and center3 signals a broader shift. India is no longer just a consumer of global connectivity. We’re finally shaping the routes, not just using them.”

Sadana argued that unlike traditional networking where an IT person can just plug a cable into a port and it works, AI networking requires intricate, custom solutions. The core challenge is creating highly optimized, efficient networking infrastructure that can support massive AI compute clusters with minimal inefficiencies. How NextHop is looking to change the game for hyperscale networking NextHop AI is working directly alongside its hyperscaler customers to develop and build customized networking solutions. “We are here to build the most efficient AI networking solutions that are out there,” Sadana said. More specifically, Sadana said that NextHop is looking to help hyperscalers in several ways including: Compressing product development cycles: “Companies that are doing things on their own can compress their product development cycle by six to 12 months when they partner with us,” he said. Exploring multiple technological alternatives: Sadana noted that hyperscalers might try and build on their own and will often only be able to explore one or two alternative approaches. With NextHop, Sadana said his company will enable them to explore four to six different alternatives. Achieving incremental efficiency gains: At the massive cloud scale that hyperscalers operate, even an incremental one percent improvement can have an oversized outcome. “You have to make AI clusters as efficient as possible for the world to use all the AI applications at the right cost structure, at the right economics, for this to be successful,” Sadana said. “So we are participating by making that infrastructure layer a lot more efficient for cloud customers, or the hyperscalers, which, in turn, of course, gives the benefits to all of these software companies trying to run AI applications in these cloud companies.” Technical innovations: Beyond traditional networking In terms of what the company is actually building now, NextHop is developing specialized network switches